An Integrated Experimental and Computational System for the Thermal Characterization of Complex Three-Dimensional Submicron Electronic Devices

摘要

The work presents the creation of an analysis engine and experimental system capable of fully characterizing the thermal behavior of complex three-dimensional active submicron electronic devices. First, the transient surface temperature field of pulsed devices is non-invasively measured with submicron spatial resolution. Next, the thermal conductivity of each thin-film layer composing the device is measured and a numerical model is built using these values. The temperature distribution map is then used as input for an ultrafast inverse computational solution to fully characterize the thermal behavior of complex three-dimensional devices. By bringing together measurement and computation, it becomes possible for the first time to non-invasively extract the transient three-dimensional thermal behavior of nanoscale embedded features that cannot otherwise be accessed. The power of the method is demonstrated by verifying that it can extract details of interest of specially constructed micro-resistors.